I-Hot Melt Adhesive ye-Electronics
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I-Hot Melt Adhesive ye-Electronics

I-Hot Melt Adhesive ye-Electronics

Imodeli TH-703, I-Hot Melt Adhesive ye-Electronics iyi-adhesive ehlanzekile-emhlophe evikela ama-PCB, ama-wire tacks kanye nezindlu ngemizuzwana kuyilapho yenza uthuli- kanye ne-splash{8}}proof seal. Iphoyinti layo lokuthambisa elingu-110℃lihlala liqinile ngaphakathi kwezinto zikagesi ezisebenza kuze kufike ku-75 degree, ngakho-ke amabhondi ngeke angene ngaphansi kokushisa kwe-transformer noma ukudlidliza kwemoto. Yenziwe ngama-hydrogenated resins nokudla-ibanga le-EVA, ifomula ye-ultra-ephansi{11}}ye-VOC isiza izimboni ziphumelele i-REACH, i-RoHS kanye nokuhlolwa komoya kwangaphakathi ngaphandle kokukhipha umoya owengeziwe.

Incazelo

Izici ezibalulekile

 

I-Hot Melt Adhesive for Electronics yenzelwe ngokukhethekile-impahla,-ithuluzi lamandla-, umshayeli we-LED-nabakhiqizi abancane-abadinga ukuhlanganiswa okusheshayo, okuhlanzekile okuhlanganiswe{4}}nokuvikelwa kwemvelo kwesikhathi eside. I-adhesive iphuma kahle ku-150-170℃ngokusebenzisa izibhamu zeglue ezingu-11 mm noma amakhanda amancane{11}}akhiphayo, i-ABS emanzisa, i-PC, i-PP, i-aluminium nethusi ngaphandle kokugqwala noma ukuqhakaza. Phakathi kwamasekhondi angu-3-6 ibhondi iphola ibe yi-thermoplastic eqinile, emhlophe, engekho phuzi eletha amandla okugunda angu-3.5 MPa kumajoyinti e-ABS/ABS futhi idlule amahora angu-1000 ku-70℃/85 % RH ngaphandle kokuncipha noma ukuqhekeka.

 

I-110℃Ring ecushwe kahle{1}}&-Iphoyinti lokuthambisa ibhola ligcina i-polymer iqinile ngesikhathi somshini ojwayelekile ozishisa ngawo{3}}, nokho ivumela ukusebenza{4}}kwezinga lokushisa eliphansi okuvikela ukushisa{5}}izingxenye ezizwelayo ezifana nama-SMD capacitor kanye{6}}nopulasitiki abancane. Uma isisethiwe, ingcina yenza amanzi aqhubekayo{8}}okuvimbela ifilimu efinyelela uthuli{9}}ukuvalwa kwemithungo evalekile, okufakiwe kwezintambo kanye nama-potting{10}}emaphethelweni e-PCB amahhala, okusika isidingo sama-silicone gaskets noma{11}}izingxenye ze-epoxies ezimbili. Ama-resin tackifying ane-hydrogen asusa amabhondi amabili angagcwalisiwe, akhiphe ukukhishwa kwe-VOC okungaphansi kuka-50 µg g⁻¹ (EU ISO 16000-6) kanye namazinga ephunga angabonakali ebangeni elingu-50 mm, esiza imigqa yokukhiqiza ukuthi ihlangabezane nezindinganiso zomoya zangaphakathi ze-LEED, WELL kanye ne-BSCI.

 

Ukwakheka kumahhala ngo-100% wama-halogen, i-antimony, izinsimbi ezisindayo, i-phthalates ne-formaldehyde, ethobelana ne-RoHS 2.0, REACH SVHC 240. Ukuhlolwa kokumelana kukhombisa u-3.8 × 10¹⁵ Ω cm ukumelana nevolumu kanye no-520 V/mil ogcina amandla e-LED adhesive azungeze i-Dielectric 2 namandla amaphuzu solder. Le nduku eshisayo-yencibilika ibamba izingxenye ngokushesha, ivala umswakama nothuli, ikwazi ukumelana namazinga okushisa ezinto zikagesi futhi igcina indawo yokusebenza iluhlaza, i-Hot Melt Adhesive for Electronics inikeza{9}}isixazululo{10}}sokuyisebenzisa, nezindleko{11}zokonga esidlula kukho konke ukuhlolwa kokuthobelana.

 

Ulwazi Lokucaciswa Komkhiqizo

 

INOMBOLO YOMBONELO

TH-703

IBRAND

Tianze

IFOMU

Induku

SIZE

11.2*300mm

UMBALA

Emhlophe

IZITHAKO EZINKULU

EVA

IPHUZU LOKUTHBISA

105-115 degrees

I-VISCOSITY @170iziqu

Phezulu

ISIKHATHI SOKUVULA

Maphakathi

UKUBEKA ISIKHATHI

Ngokushesha

UKUPAKA

20kg/ibhokisi

ISAMPELA

Isampula yamahhala iyatholakala

 

Q&A

 

Q: Ingabe le nduku yeglue ingasetshenziswa kuphela emkhiqizweni we-elekthronikhi?

A: Cha, lolu hlobo lwenduku yeglue alusebenzi emikhiqizweni kagesi kuphela, kodwa futhi lungasetshenziswa kwezinye izimboni ezifana nemboni yokupakisha.

 

Amashadi ashisayo: I-adhesive hot melt ye-elekthronikhi, Isinamathelisi esishisayo saseChina sabakhiqizi bezinto zikagesi, abahlinzeki, imboni

Ngaphambilini:Akukho Ulwazi

Ungahle Uthande

Izikhwama Zokuthenga