Ukulungiselela inqubo yokunamathela kwe-polyamide

Ukulungiswa kwe-Dimeric Linoleic Acid: I-Linoleic acid, ubumba, i-lithium carbonate, namanzi yengezwe ku-reactor futhi yashukunyiswa ngokucindezela kwe-0.8-1.2 MPa. Izinga lokushisa liphakanyiswe ku-230℃futhi liphendule amahora angu-5. Ingxube yabe isipholiswa ibe yi-100 degree, futhi i-1.92 g ye-phosphoric acid solution aqueous yengezwa. Ukucindezela kwabe sekwehliswa ku-0.3-0.5 MPa, futhi izinga lokushisa liphakanyiswe ku-150℃ngehora elingu-1. Ekugcineni, izinga lokushisa lehliswa lafika ku-100 degree, futhi ingxube yahlungwa ngenkathi ishisa ukuze isuse i-catalyst. Amafutha e-unpolymerized unsaturated acid abe esehwamuka ngaphansi kwe-vacuum ephezulu (6.7–10.7 Pa) ku-220–225℃ukuze kutholwe{20}}i-purity dimerized linoleic acid ephezulu.

Ukulungiswa kwe-Polyamide Hot Melt Adhesive: Ngaphansi kokuvikelwa kwe-nitrogen, ingxube ye-ethylenediamine ne-hexamethylenediamine yengezwe kancane kancane ngenkathi inyakaza futhi ishisa ingxube ibe yi-130 degree. Kuleli qophelo, izinga lokushisa lilawulwa ku-140-150 degree. Ngemuva kokuthi ukufakwa sekuqediwe, izinga lokushisa likhuphukela ku-205-220℃futhi ukusabela kuyaqhubeka kuze kube yilapho okuqukethwe kwamanzi omkhiqizo kusondela inani lethiyori. Khona-ke, ukucindezela kuyancishiswa, futhi ukusabela kuqhutshwa elinye ihora ku-1.3-2.7 kPa kanye ne-220-230 degree. Ekugcineni, isampula iyathathwa ukuze kunqunywe inani le-amine. Uma ihlangabezana nenkomba (cishe i-10), umkhiqizo ungapholiswa futhi ukhululwe. Iphoyinti lokuthambisa le-adhesive encibilikayo eshisayo liyahlukahluka kuye ngenani le-dilinoleic acid, i-sebacic acid, i-ethylenediamine, ne-hexamethylenediamine esetshenzisiwe.